SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility
The project will add HBM packaging capacity and an AI research center as demand for advanced memory surges, SK Hynix said.
- On Thursday, South Korean chipmaker SK Hynix held a groundbreaking ceremony for an advanced packaging facility in West Lafayette, Indiana, worth more than $4 billion.
- The project aims to meet rising demand for high-bandwidth memory chips used in AI applications. SK Hynix received up to $458 million in federal CHIPS Act funding and up to $712 million in state incentives.
- Spanning 133.5 acres, the facility will create about 1,000 direct jobs and 6,000 indirect roles related to construction and business partners. Cleanroom operations are scheduled to begin in October 2028, with mass production starting in the second half of 2029.
- CEO Kwak Noh-Jung said the factory will make Indiana a "key HBM production base in America" by 2030, strengthening the U.S. semiconductor supply chain and supporting collaboration with major AI customers including Nvidia and Microsoft.
- SK Hynix expects total U.S. investments to exceed $45 billion by 2030 as the company explores additional sites to expand its footprint and cooperation in America.
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SK Hynix Launches USD 3.87 Billion US HBM Packaging Project in Indiana
Get latest articles and stories on Business at LatestLY. South Korean chipmaker SK hynix on Thursday formally launched its USD 3.87 billion advanced chip packaging project in Indiana, a facility that is set to produce the first high bandwidth memory (HBM) in the United States, The Korea Herald reported. Business News | SK Hynix Launches USD 3.87 Billion US HBM Packaging Project in Indiana.
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WEST LAFAYETTE, Indiana — South Korean chipmaker SK Hynix said on Thursday it plans to begin volume production of its next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, as its chief executive said the company expects a current memory chip shortage to persist through the end of 2030. Chief Executive Kwak Noh-Jung expects the site to eventually reach annual capacity of hundreds of thousands of wafers. The more than $…
SK Hynix breaks ground on a $4B memory packaging hub in Indiana
SK Hynix has broken ground on a plant costing more than $4B in West Lafayette, Indiana, its first US base for packaging high-bandwidth memory, with production due in the second half of 2029. Intel’s equivalent assembly and testing plant near Wroclaw was cancelled last year after state aid had been approved. SK Hynix has put […] This story continues at The Next Web
SK Hynix Starts Construction of $4 Billion Memory Hub in Indiana
SK Hynix Inc. held a groundbreaking ceremony Thursday for its advanced memory packaging facility in Indiana, marking a milestone in Washington’s expansive campaign to rebuild domestic supply chains and manufacturing for strategically important sectors.
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