Sandisk Tapes Out Its First HBF Memory Die, Targets 2027 for Inference Product Samples

Sandisk Tapes Out Its First HBF Memory Die, Targets 2027 for Inference Product Samples

Sandisk has taped out the first High Bandwidth Flash memory die. The company put it on a slide at its 2026 Investor Day on August 13, under the header HBF Roadmap, next to what the slide labels an actual die picture. The second half of that slide covers the first HBF inference product samples: coming soon, 2027. A tapeout is a substantial milestone with any new silicon. It means the design is finished and committed to a mask set, which is the po…