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GlobalFoundries and RAAAM Memory Technologies Announce Joint Development

Summary by Semiconductor Digest
Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM.
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Semiconductor DigestSemiconductor Digest

GlobalFoundries and RAAAM Memory Technologies Announce Joint Development

Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM.

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Semiconductor Digest broke the news on Wednesday, September 2, 2026.
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