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San Francisco, California · San FranciscoCEA-Leti and STMicroelectronics have used IEDM 2025 in San Francisco to set out a route to fully monolithic silicon RF front-ends, combining high-performance active and passive devices on a single wafer through 3D sequential integration. The work targets next-generation RF and optical front-end modules for wireless and wireline communication systems. In their joint paper, “Unlocking High-Performance Si RF Platforms with SiGe HBT and RFSOI Switch…See the Story
