MALVERN, PA — Vishay Intertechnology, Inc. (NYSE: VSH) introduced a thin film submount platform designed for optical transceivers, RF modules and advanced electronic packaging applications requiring high thermal performance and signal integrity. The platform targets high-speed data communications applications, including 800G, 1.6T and 3.2T optical transceivers, where increasing power density and tighter packaging constraints require improved hea…
This story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.