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TekniPlex Targets Packaging Pain Points With New Sealing Tech in Paris
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TekniPlex Targets Packaging Pain Points With New Sealing Tech in Paris
WAYNE, PA — TekniPlex said it will showcase a new lineup of sealing technologies at Paris Packaging Week 2026, aiming to tackle persistent production challenges while elevating performance and consumer experience across packaging formats. The global packaging and materials company will unveil its next-generation sealing innovations February 5–6 at Paris Expo Porte de Versailles, Hall 1, where TekniPlex experts at Booth S50 will demonstrate solut…
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