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Taiwan breaks ground on advanced packaging industrial park

TSMC, the world’s largest contract chipmaker, will ‌build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.

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evertiq.com

Taiwan breaks ground on advanced packaging industrial park

TSMC, the world’s largest contract chipmaker, will ‌build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.

6 hours ago

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evertiq.com broke the news 6 hours ago on Wednesday, September 23, 2026.

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Taiwan breaks ground on advanced packaging industrial park

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Taiwan breaks ground on advanced packaging industrial park

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