SPIL Breaks Ground in Yunlin
4 Articles
4 Articles
SPIL breaks ground on advanced IC packaging, testing plant in Yunlin
Taipei, Aug. 12 (CNA) Siliconware Precision Industries Co. (SPIL) on Tuesday broke ground on a NT$100 billion (US$3.11 billion) Chip-on-Wafer-on-Substrate (CoWoS) plant in Yunlin County to package and test and artificial intelligence (AI) chips.
SPIL breaks ground in Yunlin
Siliconware Precision Industries Co (SPIL, 矽品精密) commenced construction yesterday of a new NT$100 billion (US$3.1 billion) chip-packaging plant in Yunlin County’s Douliou City (斗六) to scale up capacity amid artificial intelligence (AI)-driven supply bottlenecks.The Taichung-based company plans to o
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028
Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin County, Taiwan, amid surging global demand for artificial intelligence (AI) and high-performance computing (HPC). The plant will cover an area of approximately six hectares and is expected to introduce chip-on-wafer-on-substrate (CoWoS) advanced packaging technology, with a total investment of about NT$100 billion…
Siliconware Precision Industries (SPIL) held a groundbreaking ceremony today (11th) at its new plant in Douliu, Yunlin. The plant is expected to adopt the CoWoS advanced packaging process, with an investment of nearly NT$100 billion and a development area of approximately 6 hectares. The first phase is expected to be operational in 2028, creating approximately 1,300 job opportunities. Once fully operational, the plant is expected to provide more…
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