US EditionAMD and Broadcom Back Powertech's FOPLP; Monthly Revenue to Hit NT$3 Billion
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AMD and Broadcom back Powertech's FOPLP; monthly revenue to hit NT$3 billion
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC ecosystem, expecting a significant revenue surge in 2027-2028 as FOPLP capacity reaches full utilization, contributing NT$3 billion (US$95 mill…
Powertech Technology Chairman Tsai Tu-Kung stated today that memory shortages will continue, and artificial intelligence (AI) applications will not experience a bubble; AI has promising future growth, and Powertech is actively deploying FOPLP advanced packaging, aiming to achieve full FOPLP capacity by mid-2028 to meet the demand for advanced packaging such as chips and silicon photonics (CPO) optical engines.
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