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OUTR organises technical seminar on IC Packaging - OrissaPOST
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OUTR organises technical seminar on IC Packaging - OrissaPOST
Bhubaneswar: The School of Electronic Sciences (SES) at Odisha University of Technology and Research (OUTR) successfully organised a one-day technical seminar titled ‘IC Packaging and Electronic Potting Simulation Using Moldex3D’, highlighting advanced simulation-driven approaches in semiconductor manufacturing. The seminar commenced with a warm welcome address by Abhyarthana Bisoyi, followed by a vote of thanks delivered by Rashmi Rekha Sahu. T…
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