New active liquid cooling tames extreme chip heat in data centers
9 Articles
9 Articles
New active liquid cooling tames extreme chip heat in data centers
Global electronics and connectivity leader Molex is investing in CAEPlus, a thermal management startup, to advance an active liquid cooling platform designed to handle the rising heat generated by next-generation AI and high-performance computing systems. The funding will help CAEPlus develop BoundaryCool, a system that pulls heat away from graphics processing units (GPUs), central processing units (CPUs), and tensor processing units (TPUs) usin…
Molex Invests in CAEPlus to Advance Thermal Management with Active Liquid Cooling Solutions for AI Data Centers
Strategic investment drives continued innovation in active liquid cooling for next-generation AI data centers and high-performance computing applications Collaboration accelerates development and validation of proprietary active cooling platform to enhance heat transfer in liquid-cooled systems Seed funding supports long-term product roadmap and commercialization while optimizing Molex’s thermal management strategy Molex, a global electronics le…
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