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MediaTek launches new mobile chip using TSMC's most advanced technology
On Tuesday, Taiwan's MediaTek unveiled the Dimensity 9600 Pro, a smartphone chip built on TSMC's 2-nanometer process designed to deliver advanced AI features directly on premium handsets.
Seeking to challenge U.S. rival Qualcomm, MediaTek raised $3.9 billion last month through a convertible bond sale, with Nvidia investing $3.5 billion and Alphabet participating to support AI infrastructure expansion.
The new NPU 1090 tech delivers 51% higher large language model prefill performance and 55% higher token generation per watt, while the G2-Ultra NX GPU provides 27% better performance and 24% lower power consumption.
Corporate senior vice president JC Hsu noted the company is working with handset makers to limit higher component cost effects, while MediaTek also introduced the Dimensity 9600M for broader flagship market segments.
Facing competition from Qualcomm and the Apple A20 Pro, MediaTek aims to increase flagship market share as the first devices sporting the 9600 Pro launch in the next few months.