GlobalFoundries Set to Receive $300M From U.S. Department of Commerce
The award will support silicon photonics and co-packaged optics to raise data-transfer speeds and cut energy use in AI data centers.
- On Wednesday, GlobalFoundries announced a $300 million CHIPS Act award from the Department of Commerce to accelerate silicon photonics research and development for more efficient artificial intelligence data centers.
- The semiconductor maker will conduct research at facilities in Malta, New York, and Burlington, Vermont, targeting 400 gigabits per second in data throughput while cutting energy consumption to one-fifth of current systems.
- GlobalFoundries CEO Tim Breen said silicon photonics is "essential to AI infrastructure," while NVIDIA CEO Jensen Huang called the technology "essential" for scaling U.S. manufacturing capabilities.
- As part of the agreement, the Department of Commerce will receive an equity stake of approximately 1% in GlobalFoundries. Commerce Secretary Howard Lutnick said the investment will "enhance our country's domestic capabilities" and create high-paying jobs.
- This award follows the Trump Administration's broader effort to direct CHIPS Act funding toward critical semiconductor technologies, including a separate $140 million investment in Multibeam for advanced packaging development.
24 Articles
24 Articles
Commerce Dept to demand equity from 7 tech companies as a condition to tap into millions in federal funding
The Commerce Department indicated that the federal government is on track to dole out millions of dollars to seven companies to fund technology development but will require the businesses to fork over equity in exchange for the money."The Department of Commerce today announced the signing of 7 letters of intent to provide $874 million in federal incentives under the CHIPS and Science Act," a Wednesday press release noted. "These incentives will …
GlobalFoundries set to receive $300M from U.S. Department of Commerce
GlobalFoundries announced it has entered into a letter of intent (LOI) with the U.S. Department of Commerce to accelerate research and development of next-generation silicon photonics — the optical technology that moves data at the speed of light and underpins the AI and high-performance computing data centers driving the global economy.
The U.S. government has decided to provide $300 million (approximately 433 billion KRW) in support for GlobalFoundries' development of silicon photonics technology to increase data transmission speeds and power efficiency in artificial intelligence (AI) data centers. As competition in AI semiconductors expands beyond computing performance to include data transmission between chips and optical packaging technologies, the U.S. [is] building a next…
US invests $140M in advanced chip packaging for future computing
The U.S. Department of Commerce plans to invest up to $140 million in semiconductor equipment maker Multibeam to develop next-generation chip packaging technologies aimed at keeping American chipmakers competitive in the AI era. The proposed funding, announced through a Letter of Intent under the CHIPS Research and Development Office, will support research into fine-pitch advanced packaging process flows that allow multiple chips to be integrate…
Uncle Sam sees the light, offers GlobalFoundries $300M to pursue silicon photonics while taking 1% stake
The US government has signed a letter of intent to provide GlobalFoundries with $300 million in CHIPS Act funding and, at the same time, receive a one percent stake in the company worth roughly $269 million. The money's supposedly not a tit-for-tat, but an investment designed to spur development of silicon photonics networking technologies that the AI industry needs for datacenters. “With today’s compute supply chain investments, the Trump Admin…
Coverage Details
Bias Distribution
- 69% of the sources are Center
Factuality
To view factuality data please Upgrade to Premium

















