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FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026

On February 4, 2026, FIC Global, Inc. is presenting at APE 2026 in Singapore and will showcase at Booth A521 to discuss advanced packaging and volume-production support.
As AI training ramps into 2026, data centers optimize network efficiency, prompting broad 800G deployments and early 1.6T production adoption amid tighter power and thermal budgets.
Using a mature PCBA/SMT foundation, FICG offers integrated advanced packaging across Flip‑Chip, Chip‑on‑Board, Silicon Photonics and Co‑Packaged Optics, supported by high-speed signal engineering.
Supported by reliability testing, FICG's high-speed signal engineering and quality control processes shorten qualification cycles and stabilize volume production for data-center customers.
To bolster supply‑chain resilience, FICG is advancing its FICG production expansion location with production‑readiness and quality‑management frameworks to improve capacity flexibility.

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FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place February 4–6, 2026 at Sands Expo and Convention Centre, Singapore.…

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