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Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry
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Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry
The semiconductor assembly and testing service industry is undergoing a structural transformation—and at the center of it is the United States. As traditional monolithic chip scaling runs into physical and economic limits, U.S. chipmakers are leading the global transition to chiplet-based processor architectures, supported by advanced 2.5D and 3D packaging technologies. Established giants like AMD, Intel, NVIDIA, Apple, and Qualcomm are setting …
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