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/C O R R E C T I O N -- Nanoverse Technologies, Limited/

On March 3, 2026, Nanoverse Technologies Limited issued a corrected release announcing its new Advanced Packaging product family of laser singulation and metrology tools.
PR Newswire introduced incorrect information during transmission, the company said, prompting NVT to issue corrections to placement accuracy and system specifications in the release.
The flagship NVT 7700 combines laser scribing with integrated metrology, while the NVT 5500 delivers whole-wafer 2D and 3D metrology without stitching. The Advanced Packaging family includes models 5500, 6600, 7700, and the forthcoming NVT 9900 set for mid-2026.
Systems support recipe-driven automation with OHV compatibility and are SEMI compliant, enabling mixed-lot and High-Volume Manufacturing processing. NVT said the laser process delivers 2-3x higher die-break strength than current alternatives.
Set for mid-2026, the NVT 9900 adds a dual-laser configuration for high-speed full-cut singulation. NVT invites customers to www.nanovtech.com for further information on its advanced laser singulation and metrology tools.

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/C O R R E C T I O N -- Nanoverse Technologies, Limited/

In the news release, Laser Redefined, Metrology Reimagined, Data Revisualized, issued 04-Mar-2026 by Nanoverse Technologies, Limited over PR Newswire, we are advised by the company that the original version contained incorrect information introduced by PR Newswire during transmission. The complete,…

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